Thursday, February 5, 2015

Soldering job and Mounting the Instruments

The first picture here shows the soldering job I did on the BMP180 pressure sensor. It's not bad at all. It ended up not too straight (the pins make more of a 70° angle to the sensor), but at least it's on. It does work, too.

The next two pictures are images of the first mounting job. The breadboard is now attached. The RPi will go on the other side. There is space at the bottom for a power supply, and room at the top to attach the hooking mechanism for the balloon.

I also have some Styrofoam that I am going to use to make a shell for the bottom half. This will serve primarily as something to absorb the shock of impact when it lands again.

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